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DLTECH Copper heatsink, heat sink 15 × 15 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 15 × 15 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heatsink 13 × 12 × 5 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 13 × 12 × 5 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 10 × 10 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 10 × 10 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 30 × 20 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 30 × 20 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 25 × 25 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 25 × 25 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 20 × 20 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 20 × 20 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 22 × 8 × 5 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 22 × 8 × 5 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 22 × 8 × 4 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 22 × 8 × 4 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 6 × 6 × 5 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, 1 piece in the package, dimensions 6 × 6 × 5 mm
DLTECH Thermal Putty 15 W/mk 20 g
Thermal Paste - 20g, density: 3,2g/cm3, thermal conductivity of 15W/mK, no metallic particles and electrically non-conductive
DLTECH Thermal Putty 15 W/mk 10 g
Thermal Paste - 10g, density: 3,2g/cm3, thermal conductivity of 15W/mK, no metallic particles and electrically non-conductive
DLTECH 90° USB-C 3.0 OTG adapter, 40Gbps - left/right
USB Adapter - connector type, curved end, female connector USB-C, male connector USB-C
DLTECH 90° USB-C 3.0 OTG adapter, 40Gbps - front/rear
USB Adapter - connector type, curved end, female connector USB-C, male connector USB-C
DLTECH Thermal Compound 15W/mK, 3g
Thermal Paste -, density: 3,7g/cm3, thermal conductivity of 15W/mK
DLTECH 90° USB 3.0 OTG adapter - front
USB Adapter - type coupling, determination of power supply, Data, curved end, female USB-A connector, small USB-A connector
DLTech Thermal Pad 90 × 50 × 2.0 mm 15W/mK
Thermal Pad - thermal conductivity: 15 W/mK - size: 90 mm × 50 mm × 2 mm
DLTech Thermal Pad 90 × 50 × 1.0 mm 15W/mK
Thermal Pad - thermal conductivity: 15 W/mK - size: 90 mm × 50 mm × 1 mm
DLTech Thermal Pad 90 × 50 × 1.5 mm 15W/mK
Thermal Pad - thermal conductivity: 15 W/mK - size: 90 mm × 50 mm × 1,5 mm
DLTECH Thermal Compound 15W/mK, 20g
Thermal Paste -, density: 3,7g/cm3, thermal conductivity of 15W/mK
DLTech Thermal Pad 90 × 50 × 2.5 mm 15W/mK
Thermal Pad - thermal conductivity: 15 W/mK - size: 90 mm × 50 mm × 2,5 mm
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