Dobrý den, přicházejí tyto desky s nejnovějším BIOS, ktery AMD pozaduje pro ryzen 9000, presneji pro ryzen 7 9800x3d? Bez nutnosti obnovovat bios?

The ASROCK B850 Pro RS motherboard is built on the AMD B850 chipset for the AMD AM5 socket, ensuring compatibility with Ryzen™ 9000, 8000 and 7000 series processors. This ATX board offers a robust 14+2+1 phase power design with 80A Dr.MOS components for the VCore, SOC and MISC sections. The integrated power stage, optimised for synchronous step-down voltage, intelligently delivers higher current to each phase. This provides better thermal properties and superior performance compared to traditional discrete MOSFETs. The eight-layer PCB ensures stable signal paths and power planes, resulting in lower temperatures and higher energy efficiency when overclocking memory.
The board features four DDR5 slots with dual-channel mode support and overclocking up to 8000MHz via both Intel XMP and AMD EXPO profiles. The eight-layer PCB design supports modern memory modules with extreme performance. Two PCIe x16 slots are available for graphics cards and other expansion devices. The first supports the PCIe 5.0 standard and is equipped with a reinforced steel structure, which ensures the secure installation of heavy graphics cards and signal stability. The second slot operates with the PCIe 4.0 standard. There is also an M.2 slot (Key E) dedicated to Wi-Fi modules.
For storage devices, the board offers four M.2 slots of different generations: one Blazing M.2 (PCIe Gen5 x4), which reaches transfer speeds of up to 128Gb/s, two Hyper M.2 (PCIe Gen4 x4) slots, and one Ultra M.2 (PCIe Gen3 x4) slot. Aluminium alloy heatsinks keep high-speed SSDs at an optimal temperature for stable performance. The bottom M.2 heatsink dissipates heat directly through the PCB, maximising performance while maintaining system stability. Four SATA III ports are available for older storage devices.
The overall cooling concept is based on optimised aluminium heatsinks, which are key for effective heat dissipation, especially during demanding tasks like gaming or productive work. The heatsinks cover not only the VRM power section but also all M.2 slots, including the bottom cooling that uses the PCB as an additional surface for heat dissipation. This solution ensures system stability and long-term component life, even under high load.
The rear I/O panel offers a Dragon 2.5Gb LAN network port, which uses an intelligent platform providing up to 2.5× more bandwidth than standard gigabit ethernet. Content creators, gamers, and streaming service users will appreciate this when transferring files and backing up data.
This product is not an independently functional unit and may require professional installation.
Specifications can be changed without notice. Images are for illustrative purposes only.