
The SAPPHIRE EDGE AI 370 BAREBONE mini computer is a compact barebone system without pre-installed RAM, hard drive, or operating system, allowing for custom configuration according to user requirements. The device is powered by a 12-core AMD Ryzen AI 9 HX 370 processor with an integrated neural processing unit for local acceleration of artificial intelligence and machine learning tasks. Its compact design saves desk space and supports mounting on the back of a monitor. The computer is ideal for digital content creation, office environments, and local real-time data processing.
The system is powered by a 12-core AMD Ryzen AI 9 HX 370 processor with twenty-four threads. This chip runs at a base frequency of 2GHz and reaches up to 5.1GHz in Boost mode. The processor includes a 36MB cache and has a TDP of 54W. Its computing power is sufficient for demanding calculations and smooth multitasking.
The device features a dedicated neural processing unit with AMD XDNA2 architecture. This NPU delivers a standalone performance of up to 50 TOPS, while the system's total capacity is up to 80 TOPS. Hardware acceleration facilitates local processing of artificial intelligence algorithms without needing to send data to remote servers. This gives users a fast response when working with local AI applications.
Image processing is handled by an integrated AMD Radeon 890M graphics card with sixteen graphics cores. The graphics processor operates at a frequency of 2900MHz and supports modern display technologies. The graphics core plays video smoothly in high resolution and runs less demanding game titles. The system connects to external monitors via the HDMI 2.1 interface.
The barebone design gives the user freedom in choosing RAM and a hard drive. The motherboard contains two SO-DIMM slots for DDR5 memory with speeds of up to 5600MHz. The system supports a total RAM capacity of up to 96GB. For data storage, there are M.2 PCIe NVMe slots designed for installing fast SSDs of various formats.
Network connectivity consists of a fast Ethernet port with a throughput of 2.5Gb/s and a wireless module. Wireless transfers are handled via the Wi-Fi 6E standard and Bluetooth version 5.2. The rear panel houses two USB-C ports with USB 4.0 support and Power Delivery 3.0. The front offers fast USB 3.2 Gen 2 ports for easy connection of peripherals.
The 30 × 117 × 111mm chassis has ventilation openings on the sides and bottom. The airflow keeps the internal components within an optimal temperature range, even under full load. A magnetically attached cover provides easy access to the internal parts without needing a screwdriver. The device can be mounted on the back of a monitor using the included VESA mount.
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Specifications can be changed without notice. Images are for illustrative purposes only.